Products tagged with 'vita'

Open.Tech offers a full line of VITA 67.1, 67.2, 67.3 and hybrid RF/Fiber 66.5 backplane modules, plug-in modules and contacts that are designed for side-by-side implementation with VITA 46 hardware. Open.Tech VITA interconnects are the latest addition to the VPX platform and are available in high-density SMPM and SMPS series.

Open.Tech offers a full line of VITA 67.1, 67.2, 67.3 and hybrid RF/Fiber 66.5 backplane modules, plug-in modules and contacts that are designed for side-by-side implementation with VITA 46 hardware. Open.Tech VITA interconnects are the latest addition to the VPX platform and are available in high-density SMPM and SMPS series.

Open.Tech offers a full line of VITA 67.1, 67.2, 67.3 and hybrid RF/Fiber 66.5 backplane modules, plug-in modules and contacts that are designed for side-by-side implementation with VITA 46 hardware. Open.Tech VITA interconnects are the latest addition to the VPX platform and are available in high-density SMPM and SMPS series.

Open.Tech offers a full line of VITA 67.1, 67.2, 67.3 and hybrid RF/Fiber 66.5 backplane modules, plug-in modules and contacts that are designed for side-by-side implementation with VITA 46 hardware. Open.Tech VITA interconnects are the latest addition to the VPX platform and are available in high-density SMPM and SMPS series.

Open.Tech offers a full line of VITA 67.1, 67.2, 67.3 and hybrid RF/Fiber 66.5 backplane modules, plug-in modules and contacts that are designed for side-by-side implementation with VITA 46 hardware. Open.Tech VITA interconnects are the latest addition to the VPX platform and are available in high-density SMPM and SMPS series.

Amphenol’s VITA 66 family of fiber optic connector products are ruggedized blind-mate optical MT module/backplane connector systems designed to meet the VITA 66.1 and 66.4 open architecture specifications. These products can be utilized in VPX systems as defined per VITA 46 or as standalone blind-mate optical connector solutions. Amphenol’s connector systems provide reliable high-speed connections for the most extreme commercial and military environments.

The LEAP® OBT socket has been designed to host the LEAP OBT optical modules (standard & rugged). The socket is soldered onto the PCB. The socket is soldered via the corner solder pads and the electrical interfaces consists of 225 BGA solder balls. LEAP OBT is then mounted on top of the socket with 4 screws and the electrical interfaces are ensured via the 225 LGA spring contacts.

Amphenol Aerospace is the world’s leader in high-end performance interconnect products for rugged environment markets. Media and protocol conversion is an important capability enabling system connectivity from commercial off-the-shelf switches, processors, and I/O boards.